Floorspan Profiles

Vertical application
Floor to floor
Heavy materials

Floorspan profiles have been designed and engineered to support where there is a need to span between floors.

The profile geometry includes internal strengthening splines to reduce the depth of the section to 60mm, while enabling the technical characteristics to span, floor slab to floor slab. 

The advantage of reduce depth enables the profile in most instances to remain outside the insulation, creating a greatly improved building U Value.

The floorspan design is often a useful design on refurbishment projects where the building substrate is variable. The system also lends itself to heavy weight facade materials - including natural stones with a typical thickness greater than 40mm and glass.

All sections are 38mm wide into the EVT II U bracket, with a 40mm face for the intermediate profile, and a T-profile of 110mm for either where the panels join, or to take clip systems.

Bracket and profile configuration is specified by RJ Facades technical department. To submit your project specifics please go to Facade Designer.

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